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71M6511/71M6511H Demo Board User’s Manual
Figure 4-10: 71M6511 4-Layer Demo Board: Top View............................................................................................... 93
Figure 4-11: 71M6511 4-Layer Demo Board: Bottom View.......................................................................................... 94
Figure 4-12: 71M6511 4-Layer Demo Board: Top Signal Layer................................................................................... 95
Figure 4-13: 71M6511 4-Layer Demo Board: Middle Layer 1, Ground Plane. ............................................................. 96
Figure 4-14: 71M6511 4-Layer Demo Board: Middle Layer 2, Supply Plane ............................................................... 97
Figure 4-15: 71M6511 4-Layer Demo Board: Bottom Signal Layer.............................................................................. 98
Figure 4-16: DM6511T4A8 2-Layer Demo Board (Capacitive Power Supply): Top View............................................. 99
Figure 4-17: D6511T4A8 2-Layer Demo Board (Capacitive Power Supply): Top Copper Layer ................................ 100
Figure 4-18: D6511T4A8 2-Layer Demo Board (Capacitive Power Supply): Top Silk-Screen View........................... 101
Figure 4-19: D6511T4A8 2-Layer Demo Board (Capacitive Power Supply): Bottom Copper Layer........................... 102
Figure 4-20: D6511T4A8 2-Layer Demo Board (Capacitive Power Supply): Bottom Silk Screen .............................. 103
Figure 4-21: 71M6511 2-Layer Demo Board (Xformer Power Supply): Top View ...................................................... 104
Figure 4-22: 71M6511 2-Layer Demo Board (Xformer Power Supply): Bottom View................................................. 105
Figure 4-23: 71M6511 2-Layer Demo Board (Xformer Power Supply): Top Copper View ......................................... 106
Figure 4-24: 71M6511 2-Layer Demo Board (Xformer Power Supply): Bottom Copper View .................................... 107
Figure 4-25: Debug Board: Electrical Schematic........................................................................................................ 109
Figure 4-26: Debug Board: Top View......................................................................................................................... 110
Figure 4-27: Debug Board: Bottom View.................................................................................................................... 110
Figure 4-28: Debug Board: Top Signal Layer............................................................................................................. 111
Figure 4-29: Debug Board: Middle Layer 1, Ground Plane ........................................................................................ 111
Figure 4-30: Debug Board: Middle Layer 2, Supply Plane ......................................................................................... 112
Figure 4-31: Debug Board: Bottom Trace Layer ........................................................................................................ 112
Figure 4-32: TERIDIAN 71M6511 LQFP64: Pinout (Top View) ................................................................................. 115
List of Tables
Table 1-1: Jumper settings on the Debug Board.......................................................................................................... 14
Table 1-2: Straight Cable Connections ........................................................................................................................ 14
Table 1-3: Null-Modem Cable Connections ................................................................................................................. 14
Table 1-4: CE RAM Locations for Calibration Constants ............................................................................................. 31
Table 1-5: Flash Programming Interface Signals ......................................................................................................... 34
Table 1-6: MPU Input Parameters for Metering .......................................................................................................... 37
Table 1-7: MPU Input Parameters for Temperature Compensation ............................................................................ 37
Table 1-8: MPU Parameters for Pulse Source Selection ............................................................................................ 37
Table 1-9: Selectable Pulse Sources .......................................................................................................................... 38
Table 1-10: MPU Instantaneous Output Variables ....................................................................................................... 39
Table 1-11: MPU Status Word Bit Assignment ............................................................................................................ 40
Table 1-12: MPU Accumulation Output Variables ........................................................................................................ 41
Table 1-13: MPU Variables Related to Phase B (6511, Revision 3.05 only) ................................................................ 42
Table 1-14: CLI Commands for MPU Data Memory..................................................................................................... 43
Table 2-1: Calibration Summary................................................................................................................................... 55
Table 2-2: Calibration Summary................................................................................................................................... 57
Table 2-3: Power Saving Measures ............................................................................................................................. 57
Table 3-1: 71M6511 Demo Board Description: 1/3 ...................................................................................................... 69
Revision 5.4
? 2005-2007 TERIDIAN Semiconductor Corporation
Page: 7 of 115
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相关代理商/技术参数
71M6511H 制造商:TERIDIAN 制造商全称:TERIDIAN 功能描述:Single-Phase Energy Meter IC
71M6511H-DB 功能描述:开发板和工具包 - 8051 71M6511H Demo Brd RoHS:否 制造商:Silicon Labs 产品:Development Kits 工具用于评估:C8051F960, Si7005 核心: 接口类型:USB 工作电源电压:
71M6511H-IGT 制造商:TERIDIAN 制造商全称:TERIDIAN 功能描述:Single-Phase Energy Meter IC
71M6511H-IGT/F 功能描述:计量片上系统 - SoC Highly Integrated SoC w/MCU Core RoHS:否 制造商:Maxim Integrated 核心:80515 MPU 处理器系列:71M6511 类型:Metering SoC 最大时钟频率:70 Hz 程序存储器大小:64 KB 数据 RAM 大小:7 KB 接口类型:UART 可编程输入/输出端数量:12 片上 ADC: 安装风格:SMD/SMT 封装 / 箱体:LQFP-64 封装:Reel
71M6511H-IGTR 制造商:Maxim Integrated Products 功能描述:RESID. HI PRECISION METR (1P, .1%) - Tape and Reel
71M6511H-IGTR/F 功能描述:计量片上系统 - SoC Highly Integrated SoC w/MCU Core RoHS:否 制造商:Maxim Integrated 核心:80515 MPU 处理器系列:71M6511 类型:Metering SoC 最大时钟频率:70 Hz 程序存储器大小:64 KB 数据 RAM 大小:7 KB 接口类型:UART 可编程输入/输出端数量:12 片上 ADC: 安装风格:SMD/SMT 封装 / 箱体:LQFP-64 封装:Reel
71M6511-IGT 制造商:TERIDIAN 制造商全称:TERIDIAN 功能描述:Single-Phase Energy Meter IC
71M6511-IGT/F 功能描述:计量片上系统 - SoC Highly Integrated SoC w/MCU Core RoHS:否 制造商:Maxim Integrated 核心:80515 MPU 处理器系列:71M6511 类型:Metering SoC 最大时钟频率:70 Hz 程序存储器大小:64 KB 数据 RAM 大小:7 KB 接口类型:UART 可编程输入/输出端数量:12 片上 ADC: 安装风格:SMD/SMT 封装 / 箱体:LQFP-64 封装:Reel